Corrosion Terms tagged with 'Measurement'

• Abrasion Resistance Analysis
• Absolute Humidity (Humidity)
• Absolute Pressure (AP)
• AC Impedance
• Acceptable Dry Film Thickness Range
• Acoustic Beam Simulation
• Acoustic Emission
• Activation Overpotential
• Activation Polarization
• Activity Coefficient
• Activity Series
• Acute Toxicity
• Adhesion Test Failure
• Adhesive Strength
• Airborne Chlorides
• Ambient Temperature Range
• Anchor Pattern (ASTM, NACE, ISO)
• Angstrom
• Anode Corrosion Efficiency
• Anode Efficiency
• Anode Resistance
• Anodic Polarization
• Apparent Density (pb)
• Apparent Hardness
• Applied Potential
• Assay
• Atmospheric Pressure
• Atomic Absorption Spectroscopy (AAS)
• Atomic Emission Spectroscopy (AES)
• Auger Electron Spectroscopy (AES)
• Automated Ultrasonic Testing (AUT)
• Average Life
• Average Percentage Weight Loss (APWL)
• Axial Chromatism
• Backscatter
• Barcol Hardness
• Barlow's Piping Formula
• Barometric Pressure
• Bed Depth
• Bending Moment
• Bioassay
• Biochemical Oxygen Demand (BOD)
• Blasting Pressure
• Bond Strength
• Bonding Force
• Breaking Strength
• Breaking Stress
• Breakpoint Chlorination
• Brinell Hardness
• Brittleness
• Buchholz Indentation Test
• Buffer Capacity
• Cabinet Test
• Calcium Carbonate Equivalent (CCE)
• Calibration Plates
• Calibration Shim
• Calorie
• Carbon Chloroform Extract
• Carrier Gas
• Charge Transfer Resistance (RCT)
• Charpy Impact Test
• Chemical Oxygen Demand (COD)
• Chlorine Demand
• Clad Layer Thickness Checking
• Cloud Point
• Coating Strength
• Colorimetric Analysis
• Compression Force
• Compressive Strength
• Condition Monitoring (CM)
• Conditional Probability of Failure
• Conductance
• Conductivity
• Contact Resistance
• Contact Thermometer
• Containment Testing
• Continuity Bond
• Copper Strip Corrosion
• Corrosion Allowance
• Corrosion Control
• Corrosion Fatigue Limit
• Corrosion Fatigue Strength
• Corrosion Kinetics
• Corrosion Monitoring
• Corrosion Penetration Rate (CPR)
• Corrosion Potential
• Corrosion Probe
• Corrosion Rate
• Crack Sizing
• Creep Depth
• Creep Test
• Crevice Corrosion Index
• Critical Anodic Current Density
• Critical Humidity
• Critical Pigment Volume Concentration (CPVC)
• Critical Value
• Current Density
• Current Efficiency
• Cyclic Polarization
• Cyclic Voltammetry (CV)
• Dew Point
• Diamond Pyramid Hardness (DPN)
• Diffusion Coefficient
• Dimensional Stability
• Displacement
• Dry Film Thickness (DFT)
• Dry Film Thickness Gauge
• Dry Film Thickness Gauge, Destructive
• Dry Film Thickness Gauge, Eddy Current (NDT, ECT)
• Dry Film Thickness Gauge, Magnetic
• Dry to Handle Time
• Dry-Bulb Temperature (DBT)
• Dry-to-Touch Time
• Durometer
• Durometer Hardness
• Dye Penetration Test
• Dyne Liquid
• Elastic Deformation
• Elastic Modulus
• Electrical Constriction Resistance
• Electrical Resistance
• Electrochemical Corrosion Potential (Rest Potential)
• Electrochemical Equivalent (ECE)
• Electrochemical Impedance Spectroscopy (EIS)
• Electrochemical Potentiodynamic Reactivation (EPR)
• Electromagnetic Acoustic Transducer (EMAT)
• Electromotive Force Series (EMF Series)
• Elution Volume
• Energy Dispersive X-ray Spectroscopy
• Engineering Strain
• Equilibrium Constant
• Evans Diagram
• Evaporation Rate
• Exchange Current
• Extensometer
• Faraday's Law
• Fatigue
• Fatigue Strength
• Ferrite Testing
• Film Thickness
• Finite Element Analysis (FEA)
• Flexural Modulus
• Flexural Strength
• Fluid Shear Stress
• Fracture Toughness
• Free Corrosion Potential
• Galvanostatic
• Gas Flow Rate
• Gauge Pressure
• Glass Electrode
• Gouge Hardness
• Grab Sample
• Grain Size
• Hardness
• Heat Release Rate (HRR)
• Helium Leakage Test
• High Electrical Resistance
• Holiday Testing
• Hooke's Law
• Humidity
• Hydrometer Analysis
• Hydrostatic Pressure
• Impact Fatigue
• Inductively Coupled Plasma Mass Spectrometry (ICP-MS)
• Instant-Off Potential
• Interferometry
• Isocorrosion Diagram
• Kilogram (kg)
• Lap Shear Strength
• Larson-Skold Index
• Laser Profilometry
• Lateral Loading
• Leak Detection
• Leak Testing
• Life-Cycle Costing (LCC)
• Limestone Drop Test
• Linear Scanning
• Liquid Impingement Erosion Test
• Lower Explosive Limit (LEL)
• Luggin Probe
• Magnetic Particle Testing
• Magnetic Pull-Off Gauge (Type I)
• Mass Density
• Mass Spectroscopy (MS)
• Maximum Allowable Working Pressure (MAWP)
• Mechanical Adhesion Testing
• Mechanical Deformation
• Melting Point
• Metallography
• Metallurgical Testing
• Metastable
• Microscopy
• Microwear Testing
• Mill Test
• Milliamp (mA)
• Milligram Equivalent
• Millimeter (mm)
• Mils Penetration Per Year (MPY)
• Mohs Hardness Scale
• Moisture Vapor Emission Rate
• Molar Solution
• Most Probable Number (MPN)
• Nick Break Test
• Non Intrusive Inspection (NII)
• Nondestructive Testing (NDT)
• Notch Toughness Test
• Open Circuit Potential (OCP)
• Operating Pressure
• Osmotic Pressure
• Paris Law
• Particle Size
• Parting Limit
• Parts Per Million (ppm)
• Peel Strength
• Pencil Hardness Test
• Pencil-type Pull-off Gauge
• Penetration Test
• Percent Elongation
• Percent Solids
• Phase Diagram
• Phased Array (PA)
• Photoelasticity
• Pilling-Bedworth Ratio (P-B Ratio)
• Pipe Schedule Sizes
• Pipeline Current Mapper (PCM)
• Pit Gauge
• Plane Strain
• Plane Stress
• Plastic Deformation
• Plasticity
• pOH
• Polarization Curve
• Pot Life
• Practical Coverage
• Pressure
• Pressure Decay Test
• Pressure Differential
• Pressure Drop
• Profilometer
• Proof Stress
• Pull-off Adhesion Test
• Pull-off Strength
• Pullout Test
• Pulse Echo Ultrasound
• Quantitative Fit Test
• Radiography
• Remote Monitoring Unit (RMU)
• Rheology
• Rockwell Hardness Test
• Rust Rating Scale
• Ryznar Index (RSI)
• Schmidt Hammer
• Scratch Hardness
• Shear
• Shear Force
• Shear Modulus
• Shear Strain
• Shear Strength
• Sieve Analysis
• Sieve Sizes
• Sling Psychrometer
• Solar Reflective Index (SRI)
• Solids By Volume
• Solids By Weight
• Spectroelectrochemistry (SEC)
• Stand-Off Distance
• Standard Reference Electrode (SRE)
• Static Pressure
• Stoichiometric Reaction
• Strain Gauge
• Strain Rate
• Stray Current Mapper (SCM)
• Stress Concentration Factor (Kt)
• Stress Concentration Factor at a Hole
• Stress Concentration Factor Calculation
• Stress Concentration Factor Chart
• Stress Intensity Factor (K)
• Structural Health Monitoring (SHM)
• Subsurface Utility Engineering (SUE)
• Surface Analysis
• Surface Profile Comparator
• Surface Tension
• Surface Topography
• Taber Abrasion
• Tack-free Time (TFT)
• Temperature Lag
• Tensile
• Tensile Curve
• Tensile Elongation
• Tensile Modulus
• Tensile Pull-Off Adhesion Test
• Tensile Strength
• Tensile Stress
• Tensile Test
• Tension Force
• Test Strip
• Theoretical Coverage
• Thermal Conductivity
• Thermal Constriction Resistance
• Thermal Emittance
• Thermogravimetric Analysis (TGA)
• Thermostability
• Thermowell
• Thixotropic Index (TI)
• Throughput
• Time of Flight Diffraction Ultrasonic (TOFD)
• Time Of Wetness (TOW)
• Tooke Gauge
• Topaz Instrument
• Torque
• Torsion Force
• Total Acid Number (TAN)
• Total Acidity
• Total Hardness
• Total Solids
• Total Suspended Particulate (TSP)
• Total Suspended Solids (TSS)
• Transfer Efficiency
• Transverse Loading
• Tribometer
• Ultimate Tensile Strength (UTS)
• Ultimate Tensile Stress (UTS)
• Ultrasonic Corrosion Monitoring
• Ultrasonic Testing (UT)
• Ultrasonic Thickness Gauge
• Ultrasonic Thickness Inspection
• Ultrasonic Transducer
• Vacuum Decay Test
• Vapor Fraction
• Vapor Pressure
• Velocity Pressure (VP)
• Velometer
• Vickers Hardness Test
• Viscometer
• Viscosity
• Viscosity Cup
• Visual Test
• Void Volume
• Voltage Gradient
• Water Transmissibility
• Water Vapor Transmission Rate (WVTR)
• Waterline
• Weatherability
• Weathering Chamber
• Weathering Test
• Wedge
• Weld Seam Inspection
• Well Characterization Test
• Wet Air
• Wet Sponge Holiday Detector
• Working Pressure
• X-Ray Diffraction (XRD)
• X-Ray Inspection
• Yield Strength
• Zahn Cup