Physical Vapor Deposition (PVD)
Definition - What does Physical Vapor Deposition (PVD) mean?
Physical vapor deposition (PVD) is a family of coating processes in which thin films are deposited by the condensation of a vaporized form of the desired film material onto the substrate.
This process is carried out in a vacuum at temperatures between 150 and 500°C. The average thickness of various PVD coatings is 2-5 microns.
Types PVD processes include:
- Cathodic arc deposition
- Electron beam physical vapor deposition
- Evaporative deposition
- Ion plating
- Enhanced sputtering
Corrosionpedia explains Physical Vapor Deposition (PVD)
In the physical vapor deposition process, the high-purity, solid coating material (metals such as titanium, chromium and aluminum) is either evaporated by heat or by bombardment with ions (sputtering). At the same time, a reactive gas (e.g. nitrogen or a gas containing carbon) is introduced; it forms a compound with the metal vapor and is deposited on the substrate as a thin, highly adherent coating. The result is a very strong bond between the coating and the tooling substrate and tailored physical, structural and tribological properties of the film.
Advantages of PVD:
- These coatings are harder and more corrosion resistant than coatings applied by other processes.
- Most coatings have high temperature resistance, good impact strength, excellent coating adhesion, excellent abrasion resistance and are very durable.
- A multitude of substrate materials can be coated: metals, alloys, ceramics, glass, polymers, etc.
- The properties of the coating (such as hardness, structure, chemical and temperature resistance, adhesion) can be accurately controlled.
- Dies and molds for all manner of material processing
- Cutting tools
- Thin films (window tint, food packaging, etc.)
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